Designing with 0.5 mm AMD FPGA packages

Name: Designing with 0.5 mm AMD FPGA packages
Start: 2026-06-18
End: 2026-06-18

FPGA

PCB design for devices with a fine ball-grid pitch.

Recording

1 found

Materials checked: Oct 8, 2026

AMD lists this session in the Cost-optimized FPGAs track. Its later PCB webinar identifies it as the first part of the package-design series.

Oct 12 – 15, 2026 United States · San Jose

Open infrastructure sessions and Lattice–AMI demonstrations of platform firmware, management and control technologies.

Oct 16, 2026 Japan · Yokohama

AI inference with FPGA AI Suite, handwritten-digit recognition on Terasic Atum A3 Nano, and an Agilex 5 demonstration.